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The Breakthrough

0.8 W/mK in the Z direction was the top film for thermal conductivity of commercially available materials.

Until now..!

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Slide through our presentation

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Heat conductivity

Integration and microelectronic packaging technology cause the total power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturised.

This causes the generated heat to rapidly accumulate, thus resulting in the performance of electronic components declining.
Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.

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Ready to mass produce

Flexiramics™ process is flexible and high throughput, suitable for mass customized products (100x productivity of previous processes).

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Our thin film

Flexiramics™ fibers enable high Tc in a variety of different polymers composites. Please contact us if you want to discuss how to improve your polymer of interest. 

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Thermal Conductivity

The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation.  Especially in the out of plane (Z) direction.  Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction.

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Dimensional Stability

Flexiramics-E thin polymer films exhibit significantly increasing dimensional stability in thermal cycling thanks to lower CTE vs. pure polymer.

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Thermal Interface Materials

Flexiramics™ fibers can also improve the properties of a number of polymeric based thermal interface materials.

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Roadmap for partnership

Contact us to discover how we can work together.

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Our team



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