Electronics
Flexible ceramic reinforcement for high‑frequency, energy‑efficient compute
As AI, 5G/6G, and data center infrastructure scale, traditional reinforcement materials are reaching their limits. Glass fiber introduces signal loss, thermal bottlenecks, and reliability constraints at high frequencies.
Flexiramics® offers a new path forward.
What Flexiramics® Enables
High frequency performance
- Stable operation at high frequencies
- Up to 75% lower signal loss compared to glass fiber reinforced laminates
Superior thermal behavior
- 5× faster heat dissipation
- Reduced hotspots in high power and high density designs
The many benefits of Flexiramics®
- Lightweight, bendable ceramic reinforcement
- Compatible with thin, complex, or curved PCB architectures
Drop in integration
- Designed to fit existing laminate manufacturing workflows
- No major process changes required
Applications
- High‑frequency PCB laminates
- RF modules and antennas
- High‑speed interconnects
- AI accelerators and compute infrastructure
- Power electronics and thermal‑critical systems
Commercial Readiness
Flexiramics® is transitioning from pilot production to commercial deployment with leading industry partners. We provide:
- Material samples
- Technical data packages
- Co‑development support
Work With Us
Whether you are designing next generation RF systems or looking to reduce thermal and signal loss constraints, Flexiramics® can help you push performance further.
Contact us if you want to discuss how Flexiramics® can be useful for you.