Flexiramics
News
The top film for thermal conductivity of commercially available materials.
Integration and microelectronic packaging technology cause the total power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturised. This causes the generated heat to rapidly accumulate,...
Flexiramics® successfully starts Spinning unit of the new market development line Copy
Following the relocation in the new facilities and the delivery of the spinning unit, the first sample of Flexiramics® Electronics was successfully spun with the new spinning head. This is a key component of the market development line enabling much higher...