The stunning thermal conductivity results of Flexiramics-E thin film
Integration and microelectronic packaging technology cause the total power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturised.
This causes the generated heat to rapidly accumulate, thus resulting in the performance of electronic components declining.
Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.
The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation. Especially in the out of plane (Z) direction. Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction.
Flexiramics-E thin polymer film can be mass produced. Please contact us if you want to discuss how we can help you or download our PowerPoint for more information.