Slide through our presentation
Integration and microelectronic packaging technology cause the total power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturised.
This causes the generated heat to rapidly accumulate, thus resulting in the performance of electronic components declining.
Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.
Ready to mass produce
Flexiramics™ process is flexible and high throughput, suitable for mass customized products (100x productivity of previous processes).
Our thin film
Flexiramics™ fibers enable high Tc in a variety of different polymers composites. Please contact us if you want to discuss how to improve your polymer of interest.
The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation. Especially in the out of plane (Z) direction. Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction.
Flexiramics-E thin polymer films exhibit significantly increasing dimensional stability in thermal cycling thanks to lower CTE vs. pure polymer.
Thermal Interface Materials
Flexiramics™ fibers can also improve the properties of a number of polymeric based thermal interface materials.
Roadmap for partnership
Contact us to discover how we can work together.
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