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Flexiramics B.V. is pleased to announce that their Flexiramics-E thin film products have reached a bulk thermal conductivity of 1.8 W/mK in the Z-direction. This breakthrough result makes the thermal conductivity of Flexiramics-E thin film twice as high as any other thin film available on the market today.

Flexiramics-E prevents sub-optimal performance of electronic components
Integration and microelectronic packaging technology are causing the power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturized. This causes the generated heat to rapidly accumulate, thus resulting in sub-optimal performance of electronic components. Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.

Thermal conductivity compared
The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation. Especially in the out of plane (Z) direction. Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction. And future generations can achieve even higher values. As additional benefits, Flexiramics-E thin polymer films exhibit significantly increased dimensional stability in thermal cycling thanks to lower CTE vs. pure polymer.

About Flexiramics B.V.
Flexiramics B.V. is specialized in the design, development and manufacturing of nanostructured ceramics. Flexiramics® fibers have the unique and novel characteristics of being purely ceramic and flexible at the same time. The level of flexibility, density, the ceramic composition and the geometry of the material are just some of the parameters that can be customized based on application and customer needs. Flexiramics® products can be used in aerospace, batteries, electronics, filtration and many more fields.

Flexiramics® products improve thermal conductivity, coefficient of thermal expansion, micro- filtration in harsh environment, safety at high temperature and in presence of fires, Li conductivity, haptics and many more properties in the final applications.

For additional information, please contact Tanja Wortel at +31 68 68 68 115 or via e-mail at tanja.wortel@flexiramics.com.

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Heat conductivity

Integration and microelectronic packaging technology cause the total power density of electronic components to increase, while their dimensions and those of electronic devices are getting smaller and miniaturised.

This causes the generated heat to rapidly accumulate, thus resulting in the performance of electronic components declining.
Therefore, the heat dissipation of electronic components has evolved into a major focus of current electronic components and electronic device manufacturing.

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Ready to mass produce

Flexiramics™ process is flexible and high throughput, suitable for mass customized products (100x productivity of previous processes).

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Our thin film

Flexiramics™ fibers enable high Tc in a variety of different polymers composites. Please contact us if you want to discuss how to improve your polymer of interest. 

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Thermal Conductivity

The thermal conductivity of the circuit boards is particularly low for flexible substrates, and this remains a critical bottleneck regarding improved heat dissipation.  Especially in the out of plane (Z) direction.  Most commercially available materials have a Tc between 0.2 and 0.8 W/mK in the Z-direction. Flexiramics-E thin polymer films have achieved 1.8 W/mK in the Z-direction.

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Dimensional Stability

Flexiramics-E thin polymer films exhibit significantly increasing dimensional stability in thermal cycling thanks to lower CTE vs. pure polymer.

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Thermal Interface Materials

Flexiramics™ fibers can also improve the properties of a number of polymeric based thermal interface materials.

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Roadmap for partnership

Contact us to discover how we can work together.

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Our team